%0 Journal Article
%T Creation of Vias With Optimized Profile for 3‐D Through Silicon Interconnects (TSV)
%A Richter, Karola
%A Viehweger, Kay
%A He, Jian
%A Bartha, Johann‐Wolfgang
%J Plasma Processes and Polymers
%V 6
%N S1
%P S193-S197
%@ 1612-8850
%D 2009-06-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve