%0 Journal Article
%T Thermal analysis of a multi-chip package design
%A Darveaux, Robert
%A Hwang, Lih-Tyng
%A Reisman, Arnold
%A Turlik, Iwona
%J Journal of Electronic Materials
%V 18
%N 2
%P 267-274
%@ 0361-5235
%D 1989-03-01
%I Springer-Verlag
%~ DeepDyve