%0 Journal Article
%T Height inspection of wafer bumps without explicit 3D reconstruction
%A Dong, Mei
%A Lam, Edmund Y.
%J Proceedings of SPIE
%V 6070
%N 1
%P 607004-607004-8
%@ 0277-786X
%D 2006-02-02
%I SPIE
%~ DeepDyve