%0 Journal Article
%T Material and technological aspects of high-temperature SiC device packages reliability
%A Myśliwiec, Marcin
%A Kisiel, Ryszard
%A Guziewicz, Marek
%J Microelectronics International
%V 32
%N 3
%P 143-148
%@ 1356-5362
%D 2015-08-03
%I Emerald Group Publishing Limited
%~ DeepDyve