%0 Journal Article
%T Effects of Bi Addition on the Solderability and Mechanical Properties of Sn-Zn-Cu Lead-Free Solder
%A Pu, Cunji
%A Qiu, Jialong
%A Li, Caiju
%A Gao, Peng
%A Peng, Yanzhi
%A He, Qi
%A Bai, Hailong
%A Yi, Jianhong
%J Journal of Electronic Materials
%V 51
%N 9
%P 4952-4963
%@ 0361-5235
%D 2022-09-01
%I Springer US
%~ DeepDyve