%0 Journal Article
%T Physical properties of epoxy molding compound for semiconductor encapsulation according to the coupling treatment process change of silica
%A Kim, Whan Gun
%A Ryu, Je Hong
%J Journal of Applied Polymer Science
%V 65
%N 10
%P 1975-1982
%@ 0021-8995
%D 1997-01-06
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve