%0 Journal Article
%T Analysis of underfill technology for large-scale IRFPA devices
%A Kang, Zhe
%A Wen, Tao
%A Wei, Shuling
%J Proceedings of SPIE
%V 11563
%P 115630H-115630H-9
%@ 0277-786X
%D 2020-11-05
%I SPIE
%~ DeepDyve