%0 Journal Article
%T Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications
%A Che Ani, F.
%A Jalar, A.
%A Ismail, R.
%A Othman, N.
%A Khor, C.
%A Samsudin, Z.
%A Abdullah, M.
%A Azmi, A.
%J Arabian Journal for Science and Engineering
%V 41
%N 5
%P 1813-1823
%@ 1319-8025
%D 2015-12-09
%I Springer Berlin Heidelberg
%~ DeepDyve