%0 Journal Article
%T Soldering and Bonding in Contemporary Electronic Device Packaging
%A Li, Yuxuan
%A Pan, Bei
%A Ge, Zhenting
%A Chen, Pengpeng
%A Bi, Bo
%A Yi, Xin
%A Wu, Chaochao
%A Wang, Ce
%J Materials
%V 18
%N 9
%D 2025-04-29
%I MDPI
%~ DeepDyve