%0 Journal Article
%T Key technology developments of active optical package (AOP) substrate for co-packaging of silicon photonics
%A Noriki, A.
%A Tamai, I.
%A Ibusuki, Y.
%A Ukita, A.
%A Suda, Satoshi
%A Shimura, D.
%A Onawa, Y.
%A Yaegashi, H.
%A Amano, T.
%A Mori, M.
%J Proceedings of SPIE
%V 11364
%P 113640S-113640S-6
%@ 0277-786X
%D 2020-04-02
%I SPIE
%~ DeepDyve