%0 Journal Article
%T Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators
%A Yu, Yongjia
%A Yang, Xin
%A Liu, Qianfa
%A She, Naidong
%A Liu, Dongliang
%A Huang, Wei
%J Polymers For Advanced Technologies
%V 33
%N 9
%P 2908-2920
%@ 1042-7147
%D 2022-09-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve