%0 Journal Article
%T The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging
%A Li, Dejian
%A Li, Bofu
%A Han, Shunfeng
%A Li, Dameng
%A Yang, Baobin
%A Gong, Baoliang
%A Zhang, Zhangzhang
%A Yu, Chang
%A Chen, Pei
%J Micromachines
%V 16
%N 2
%@ 2072-666X
%D 2025-01-22
%I Multidisciplinary Digital Publishing Institute
%~ DeepDyve