%0 Journal Article
%T Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions
%A Wang, Wenhui
%A Zhao, Xingke
%A Zhao, Zenglei
%A Rong, Yuhan
%J Journal of Materials Science Materials in Electronics
%V 34
%N 8
%@ 0957-4522
%D 2023-03-01
%I Springer US
%~ DeepDyve