%0 Journal Article
%T Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
%A Madadnia, Behnam
%A Bossuyt, Frederick
%A Vanfleteren, Jan
%J The International Journal of Advanced Manufacturing Technology
%V 119
%N 9-10
%P 6649-6663
%@ 0268-3768
%D 2022-04-01
%I Springer London
%~ DeepDyve