Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System

PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System This, the third in a series of papers, reports an investigation of the semiadditive process strategies of PWB manufacture. It will show that, although the adoption of a naked palladium catalyst is the optimal production strategy in terms of cost, caution must be exercised in its implementation, particularly with regard to material process flow and solder mask type employed. It will be demonstrated that the use of a thin, sacrificial flash of electroless copper prior to circuitisation and full build deposition will be required for the liquid photoimageable soldermask LPISM approach. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System

Circuit World , Volume 19 (2): 10 – Jan 1, 1993

Loading next page...
 
/lp/emerald-publishing/pwb-interconnect-strategy-using-a-full-build-electroless-copper-1jfO6ItFjI

References (3)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046196
Publisher site
See Article on Publisher Site

Abstract

This, the third in a series of papers, reports an investigation of the semiadditive process strategies of PWB manufacture. It will show that, although the adoption of a naked palladium catalyst is the optimal production strategy in terms of cost, caution must be exercised in its implementation, particularly with regard to material process flow and solder mask type employed. It will be demonstrated that the use of a thin, sacrificial flash of electroless copper prior to circuitisation and full build deposition will be required for the liquid photoimageable soldermask LPISM approach.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1993

There are no references for this article.