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R. Kennedy, K. Minten, Xiuru Yang, D. Evans (1991)
Growth structures of electroless copper films for printed wiring boardsJournal of Vacuum Science & Technology B, 9
A. Sutyagina, G. Vovchenko (1981)
The effects of the nature and the structure of platinum group catalysts on their poisining and regenerationSurface Technology, 13
J. Cisson, J. Seigo, K. Minten (1992)
PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System:: Part 2: Etch CharacteristicsCircuit World, 18
This, the third in a series of papers, reports an investigation of the semiadditive process strategies of PWB manufacture. It will show that, although the adoption of a naked palladium catalyst is the optimal production strategy in terms of cost, caution must be exercised in its implementation, particularly with regard to material process flow and solder mask type employed. It will be demonstrated that the use of a thin, sacrificial flash of electroless copper prior to circuitisation and full build deposition will be required for the liquid photoimageable soldermask LPISM approach.
Circuit World – Emerald Publishing
Published: Jan 1, 1993
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