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References (4)
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J. Pavio, D. Hyde (1991)
Effects of coefficient of thermal expansion mismatch on solder attached GaAs MMICs1991 IEEE MTT-S International Microwave Symposium Digest
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M. Aghajanian, M. Rocazella, J. Burke, S. Keck (1991)
The fabrication of metal matrix composites by a pressureless infiltration techniqueJournal of Materials Science, 26
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C. Williams (1991)
Design considerations for microwave packagesAmerican Ceramic Society Bulletin, 70
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D. Amey, J. Curilla (1991)
Microwave properties of ceramic materials1991 Proceedings 41st Electronic Components & Technology Conference
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/eb044516
- Publisher site
- See Article on Publisher Site
Abstract
This paper describes some of the benefits of electronic packages manufactured from silicon carbide reinforced aluminium composites. The housings which were analysed and tested consisted of ironnickel alloy sidewalls soldered to composite bases. The metal matrix composite bases were produced using Lanxide's PRIMEX pressureless metal infiltration process. Hermeticity test results on the base to sidewall seals are presented along with comparative electrical performance of the composite versus conventional base materials. Analysis of the thermal, mechanical and weight performance of this approach is also provided.
Journal
Microelectronics International – Emerald Publishing
Published: Jan 1, 1994