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A. Wilson (1981)
Polyimide insulators for multilevel interconnectionsThin Solid Films, 83
A. Endo, T. Yada (1985)
Thermal and Physical Properties and Etching Characteristics of PI FilmsJournal of The Electrochemical Society, 132
P. Smith, T. Herndon, R. Burke, D. Day, S. Senturia (1983)
Evaluation of a Process for Achieving Low Between‐Metal Contact Resistance in Plasma Etched Polyimide ViasJournal of The Electrochemical Society, 130
N. Sato, Masayuki Suzuki, Yuichi Sato (1983)
Measurement of Electroless Plating Rate by Coulostatic MethodJournal of The Electrochemical Society, 130
P. Sanda, J. Bartha, J. Clabes, J. Jordan, C. Feger, B. Silverman, P. Ho (1986)
Interaction of metals with model polymer surfaces: Core level photoemission studiesJournal of Vacuum Science and Technology, 4
P. Ho, P. Hahn, J. Bartha, G. Rubloff, F. Legoues, B. Silverman (1985)
Chemical bonding and reaction at metal/polymer interfacesJournal of Vacuum Science and Technology, 3
N. Chou, C. Tang (1984)
Interfacial reaction during metallization of cured polyimide: An XPS studyJournal of Vacuum Science and Technology, 2
S. Chambers, K. Chakravorty (1988)
Oxidation at the polyimide/Cu interfaceJournal of Vacuum Science and Technology, 6
L. Rothman (1980)
Properties of Thin Polyimide FilmsJournal of The Electrochemical Society, 127
Since the first appearance of high density interconnection systems about ten years ago, researchers have tried to exploit this concept to the full. By introducing new technologies and materials, they have succeeded in building a module that equals wafer scale integration WSI in speed and efficiency. However, MCMs have not yet experienced rapid growth and acceptance as a result of the large capital investment and rather small volumes involved. This paper sets out to show that MCMs can be fabricated using technology and processes already in existence at most conventional IC and thinfilm production facilities.
Microelectronics International – Emerald Publishing
Published: Jan 1, 1993
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