Access the full text.
Sign up today, get DeepDyve free for 14 days.
Loading next page...
/lp/emerald-publishing/multichip-modules-for-telecom-applications-fPhLrsmsZe
References (1)
-
W. Knausenberger, L. Schaper (1984)
Interconnection Costs of Various Substrates-The Myth of Cheap WireIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 7
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/eb044448
- Publisher site
- See Article on Publisher Site
Abstract
System performance can be improved by the use of MCM multichip module technology. Better signal transmission properties, lower power dissipation if CMOS chips are used and decreased physical volume will be obtained. Today MCM is an expensive technique, but the authors' cost analysis shows that it has the potential to become more costeffective than the standard technique of using single chip packages. It can also become more costeffective to use the MCM technique than to increase the number of gates on the silicon chip over a certain level. In order to study the properties of MCM technology, a project has been started at the authors' company in which a processor application is built up on three different types of MCM substrates.
Journal
Microelectronics International – Emerald Publishing
Published: Feb 1, 1991