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Preparation of water-resistant adhesives from soy flour with less water-soluble components for wood bonding

Preparation of water-resistant adhesives from soy flour with less water-soluble components for... PurposeThe purpose of this paper is to prepare a water-resistant adhesive (SA) from soy flour (SF) with less water-soluble components.Design/methodology/approachDefatted SF was suspended and stirred in water. Then, the pH of dispersion was adjusted to a predetermined value (i.e. 8, 9 or 10) by the addition of 2M sodium hydroxide (NaOH) solution. After stirring at a predetermined temperature (25°C, 35°C, 45°C) for different time (1 h, 2 h, 3 h), the 2M hydrochloric acid (HCl) solution was added in a dropwise manner into the dispersion until the pH value was adjusted to 4.5. Then, the dispersion was centrifuged at 6,000 rpm for 2 min. The obtained precipitate with less water-soluble components was used as an adhesive (SA) directly.FindingsSA had a wet strength of 1.02 MPa when used for the fabrication of poplar plywood. Polyvinyl alcohol (PVA) solution was applied to improve the tack of SAs to wood surface and the viscosities of SAs were decreased from 10,200 cP to 4,100 cP at room temperature after the PVA addition. The soy proteins in SAs were not denatured to a large extent according to the differential scanning calorimetry and light microscopy. The remained multilevel structures of soy protein played a positive contribution to the water resistance of SAs, and the bond lines of cured SAs were much more stable than those of the cured SF and soy protein concentrate (SPC).Research limitations/implicationsThe fluidity and solid content of soy adhesives is much lower than formaldehyde adhesives. Further investigations are needed to improve the fluidity of soy adhesives with high solid contents.Originality/valueNovel water-resistant soy adhesives were provided. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Pigment & Resin Technology Emerald Publishing

Preparation of water-resistant adhesives from soy flour with less water-soluble components for wood bonding

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References (20)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0369-9420
DOI
10.1108/PRT-04-2016-0042
Publisher site
See Article on Publisher Site

Abstract

PurposeThe purpose of this paper is to prepare a water-resistant adhesive (SA) from soy flour (SF) with less water-soluble components.Design/methodology/approachDefatted SF was suspended and stirred in water. Then, the pH of dispersion was adjusted to a predetermined value (i.e. 8, 9 or 10) by the addition of 2M sodium hydroxide (NaOH) solution. After stirring at a predetermined temperature (25°C, 35°C, 45°C) for different time (1 h, 2 h, 3 h), the 2M hydrochloric acid (HCl) solution was added in a dropwise manner into the dispersion until the pH value was adjusted to 4.5. Then, the dispersion was centrifuged at 6,000 rpm for 2 min. The obtained precipitate with less water-soluble components was used as an adhesive (SA) directly.FindingsSA had a wet strength of 1.02 MPa when used for the fabrication of poplar plywood. Polyvinyl alcohol (PVA) solution was applied to improve the tack of SAs to wood surface and the viscosities of SAs were decreased from 10,200 cP to 4,100 cP at room temperature after the PVA addition. The soy proteins in SAs were not denatured to a large extent according to the differential scanning calorimetry and light microscopy. The remained multilevel structures of soy protein played a positive contribution to the water resistance of SAs, and the bond lines of cured SAs were much more stable than those of the cured SF and soy protein concentrate (SPC).Research limitations/implicationsThe fluidity and solid content of soy adhesives is much lower than formaldehyde adhesives. Further investigations are needed to improve the fluidity of soy adhesives with high solid contents.Originality/valueNovel water-resistant soy adhesives were provided.

Journal

Pigment & Resin TechnologyEmerald Publishing

Published: Jul 3, 2017

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