The Application of Machine Vision to IC Surface Inspection
The Application of Machine Vision to IC Surface Inspection
Yi‐Chan Chung; Chih‐Hung Tsai; Yu‐Tang Lin
2003-08-21 00:00:00
During IC inspection, which includes the two parts of Mark and Lead, the deviation of IC on the tape occurring in high speed movements usually generates light reflection effect, which in turn causes errors in IC recognition as measured by machine vision system. this research filters the light reflection effect by developing standard components, identifies the correct position of IC Lead, hence fixes the measurement errors or non‐measurability caused by light reflection, avoids the resulting discontinued operation of measuring system, and improves the productivity.
http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.pngAsian Journal on QualityEmerald Publishinghttp://www.deepdyve.com/lp/emerald-publishing/the-application-of-machine-vision-to-ic-surface-inspection-KLJGK1jybH
The Application of Machine Vision to IC Surface Inspection
During IC inspection, which includes the two parts of Mark and Lead, the deviation of IC on the tape occurring in high speed movements usually generates light reflection effect, which in turn causes errors in IC recognition as measured by machine vision system. this research filters the light reflection effect by developing standard components, identifies the correct position of IC Lead, hence fixes the measurement errors or non‐measurability caused by light reflection, avoids the resulting discontinued operation of measuring system, and improves the productivity.
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