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References (1)
-
E. Kemppinen, P. Mikkonen, P. Collander, S. Leppävuori (1998)
Performance of Cu‐ and Ag‐based microstrips up to millimetre wave frequenciesMicroelectronics International, 15
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565369810234978
- Publisher site
- See Article on Publisher Site
Abstract
In order for system designers to make full use of the successive generations of semiconductor devices it is becoming increasingly necessary to choose interconnection systems that are tailored to the application. As this trend becomes more pronounced, the limitations of traditional methods of constructing boards onto which electronic components can be assembled are becoming more obvious. In this paper the application of selective electroplating, a technique that has been in use for many years but has not previously been fully exploited, is discussed. It is shown by examining a number of case studies that with a small amount of innovation this basic technique can be extended to meet the needs of a number of application areas while still operating within the normal processing windows of the materials.
Journal
Microelectronics International – Emerald Publishing
Published: Dec 1, 1998