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Precision Tin/Lead Alloy Plating for Flip‐Chip Mounting Technology

Precision Tin/Lead Alloy Plating for Flip‐Chip Mounting Technology http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International CrossRef

Precision Tin/Lead Alloy Plating for Flip‐Chip Mounting Technology

Microelectronics International , Volume 14 (1): 9-13 – Apr 1, 1997
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References (8)

Publisher
CrossRef
ISSN
1356-5362
DOI
10.1108/13565369710800420
Publisher site
See Article on Publisher Site

Abstract

Journal

Microelectronics InternationalCrossRef

Published: Apr 1, 1997

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