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C. Lea (1988)
A scientific guide to surface mount technology
E. Oh (1995)
The Impact of Soldering Temperatures on No‐clean Hand Soldering ProcessesSoldering & Surface Mount Technology, 7
J. Jachim, G. Freeman, L. Turbini (1997)
Use of surface insulation resistance and contact angle measurements to characterize the interactions of three water soluble fluxes with FR-4 substratesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 20
C. Park, B. Han, H. Bair, V. Raju (1997)
Evaluation of epoxy underfill materials for solder flip-chip technologyJournal of Materials Science Letters, 16
A. Tuominen, V. Lehtinen, K. Kulojärvi, J. Kivilahti (1998)
Verification of fluxes for flip chip assemblyThe International journal of microcircuits and electronic packaging, 21
Owing to the incessant demand for reductions in the size of portable electronics, new dense packaging technologies are required. Reflow soldering is still mainly used for component joining on the substrate. In tiny joints such as those in flip chip (FC) assemblies the flux effect is vitally important and needs to pass a narrower performance window than in ordinary surface mount technology (SMT). The determination of the suitability of a flux, as reported in this paper, is twofold; first, the flux must perform well in its intended purpose and second, the flux must not leave harmful residues causing leakage or electromigration. The first test used was the wetting balance test for all fluxes. Fluxes accepted on the basis of the wetting tests were then subjected to the surface insulation resistance test (SIR).
Soldering & Surface Mount Technology – Emerald Publishing
Published: Apr 1, 1999
Keywords: Flip chip; Flux; Surface insulation resistance; Wetting balance method
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