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Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*

Microstructurally Based Finite Element Simulation on Solder Joint Behaviour* http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology CrossRef

Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*

Soldering & Surface Mount Technology , Volume 9 (1): 39-42 – Jun 1, 1997
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References (14)

Publisher
CrossRef
ISSN
0954-0911
DOI
10.1108/09540919710800601
Publisher site
See Article on Publisher Site

Abstract

Journal

Soldering & Surface Mount TechnologyCrossRef

Published: Jun 1, 1997

There are no references for this article.