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Design, materials and process for lead‐free assembly of high‐density packages

Design, materials and process for lead‐free assembly of high‐density packages The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Design, materials and process for lead‐free assembly of high‐density packages

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References (3)

Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910410517068
Publisher site
See Article on Publisher Site

Abstract

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Apr 1, 2004

Keywords: Soldering; Design for assembly; Packaging materials; Surface fitting; Printed‐circuit boards

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