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J. Lau, W. Dauksher, J. Smetana, R. Horsley, D. Shangguan, T. Castello, I. Menis, D. Love, B. Sullivan (2004)
Design for lead‐free solder joint reliability of high‐density packagesSoldering & Surface Mount Technology, 16
J. Lau, N. Hoo, R. Horsley, J. Smetana, D. Shangguan, W. Dauksher, D. Love, I. Menis, B. Sullivan (2004)
Reliability testing and data analysis of lead‐free solder joints for high‐density packagesSoldering & Surface Mount Technology, 16
C. Wong, J. Lau, J. Lau, N. Lee (2002)
Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Apr 1, 2004
Keywords: Soldering; Design for assembly; Packaging materials; Surface fitting; Printed‐circuit boards
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