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In‐house development of low cost automatic IC workcell for BGA solder ball attachment

In‐house development of low cost automatic IC workcell for BGA solder ball attachment Purpose – The purpose of this paper is to develop a cost effective ball grid array (BGA) workcell for solder ball attachment. Design/methodology/approach – This paper presents the construction of a low‐cost high‐efficiency automatic ball attachment workcell. In fact, it is an economical means of simultaneous placement of all solder balls on BGA substrates containing multiple BGA units as well as singulated substrates. Common industry problems such as the effect of static charges, the solder ball oxidation, the missing ball, the extra ball, the ball alignment, the deformed ball and, etc. will be addressed and critical issues affecting yield will also be discussed in this paper. Findings – BGA is a popular integrated circuit packaging that is often applied in laptop computers and other handheld electronic devices for the provision of a high‐connection count in a relatively small area. However, the cost of a market available BGA solder ball attachment workcell is very expensive and the flexibility in fitting various customized process is usually low. Originality/value – The developed workcell cost is about half of the market available machines with similar specifications; the yield achieved is within three sigma confidence interval with competitive output rate. The maintenance and troubleshooting are easy since the machine was developed by the in‐house engineering team. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Assembly Automation Emerald Publishing

In‐house development of low cost automatic IC workcell for BGA solder ball attachment

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References (9)

Publisher
Emerald Publishing
Copyright
Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
ISSN
0144-5154
DOI
10.1108/01445150810889510
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to develop a cost effective ball grid array (BGA) workcell for solder ball attachment. Design/methodology/approach – This paper presents the construction of a low‐cost high‐efficiency automatic ball attachment workcell. In fact, it is an economical means of simultaneous placement of all solder balls on BGA substrates containing multiple BGA units as well as singulated substrates. Common industry problems such as the effect of static charges, the solder ball oxidation, the missing ball, the extra ball, the ball alignment, the deformed ball and, etc. will be addressed and critical issues affecting yield will also be discussed in this paper. Findings – BGA is a popular integrated circuit packaging that is often applied in laptop computers and other handheld electronic devices for the provision of a high‐connection count in a relatively small area. However, the cost of a market available BGA solder ball attachment workcell is very expensive and the flexibility in fitting various customized process is usually low. Originality/value – The developed workcell cost is about half of the market available machines with similar specifications; the yield achieved is within three sigma confidence interval with competitive output rate. The maintenance and troubleshooting are easy since the machine was developed by the in‐house engineering team.

Journal

Assembly AutomationEmerald Publishing

Published: Aug 1, 2008

Keywords: Integrated circuit technology; Solder; Flipchips; Substrates

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