1 - 6 of 6 articles
This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.Design/methodology/approachSolder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5...
A numerical study on the reliability of soldered interconnects of c-Si solar photovoltaic cells has been conducted.Design/methodology/approachA three-year data (2012–2014) from outdoor weathering of PV modules was used to generate temperature cycle profiles to serve as thermal loads and boundary...
This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying...
This paper aims to analyze the effect of cerium addition on the microstructure and the mechanical properties of Tin-Silver-Copper (SAC) alloy. The mechanical properties and refined microstructure of a solder joint are vital for the reliability and performance of electronics. SAC305 alloys are...
Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These research studies do not have too much impact on the improvement of solders’ performance but were difficult to achieve satisfactory results. It is urgent to...
The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.Design/methodology/approachSeveral accelerated shear stress tests under different stress...
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