1 - 6 of 6 articles
PurposeThis paper aims to discuss the key factors affecting the quality characteristics, such as the number of solder balls, the spread distance of residual underfill and the completion time of the underfilling.Design/methodology/approachThe Taguchi method is applied to configure the orthogonal...
PurposeAs in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to...
PurposeThe surface finish is an essential step in printed circuit boards design because it provides a solderable surface for electronic components. The purpose of this study to investigate the effects of different surface finishes during the soldering and ageing...
PurposeAutomatic optical inspection (AOI) systems have been widely used in many fields to evaluate the qualities of products at the end of the production line. The purpose of this paper is to propose a local-to-global ensemble learning method for the AOI system based on to inspect integrated...
PurposeThe purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation mechanism during the underfill flow was...
PurposeIn surface mount assembly (SMA) process, small components are subjected to high temperature variations, which result in components’ deformation and cracking. Because of this phenomenon, cracks are formed in the body of carbonyl powder ceramic inductor (CPCI) in the preheat and cooling...
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