1 - 7 of 7 articles
PurposeThe purpose of this study is to develop a monolayer surface coating of stearic acid on Sn-Ag-Cu solder powder to limit oxidation.Design/methodology/approachStearic acid was adsorbed onto Sn-Ag-Cu solder powder through liquid-phase adsorption. The isotherm of adsorption was measured and...
PurposeThis study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu3Sn proportion and joints with the conventional interfacial structure in electronic packaging.Design/methodology/approachThe Cu-Sn IMCs joints with different Cu3Sn proportion...
PurposeThe purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy.Design/methodology/approachThe diffusion behaviors of different atoms at the...
PurposeThis study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the mechanical properties of the eutectic tin–silver (Sn-Ag) such as tensile strength, plasticity and creep...
PurposeCrack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering...
PurposeThe purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion will highlight the configurations and recent developments on each of the compiled characterization techniques of potentiodynamic...
PurposeTo explore substitutes for traditional Sn-Pb solder, Sn-20In-2.8Ag was considered because of its appropriate melting temperature, good reliability and high ductility at less than 100°C. However, the mechanical properties of Sn-20In-2.8Ag were not satisfactory. The reason for the poor...
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