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Purpose – The transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials. Design/methodology/approach – The structure of CNFs was confirmed by transmission electron...
Purpose The purpose of this paper is to present a process chemical stripping that can be used to remove pure tin plating from component leads and propose this activity as a mitigation strategy for tin whisker risk reduction associated with spacecraft hardware. The problems associated with the...
Purpose – The purpose of this work is to investigate the influence of carbon nanotube additions to solder paste on the solder joints mechanical strength and their microstructure. In our investigation, the basic solder paste contains 85 wt.% of the commercial Sn96.5Ag3Cu0.5 powder (with the...
Purpose – The purpose of this paper is to overview the effect of electroplating current wave forms on Cu filling of through‐silicon‐vias (TSV) for three‐dimensional (3D) packaging. Design/methodology/approach – The paper takes the form of a literature review. Findings – Effective TSV technology...
Purpose Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this...
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