1 - 7 of 7 articles
Purpose – The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior on copper substrates at 523 K. Design/methodology/approach – Viscosity,...
Purpose – Out‐of‐plane displacement (warpage) is one of the major thermomechanical reliability concerns for board‐level electronic packaging. The warpage and residual stresses can cause unreliability in the performance of electronic chip. An accurate estimation of the distortion and the residual...
Purpose – The purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely mechanical load. Design/methodology/approach – Bond wires with different geometries were tested with various...
Purpose – Laser systems are becoming more and more a commodity in many fields of application and this is driving a strong trend towards increasingly efficient production technologies and miniaturized products. A central aspect of laser production is the assembly where the majority of cost is due...
Purpose – The purpose of this paper is to evaluate the mechanical properties of nano‐silver paste sintered lap shear structures and to discuss the effects of loading rate and ambient temperature on shear strength and fracture mechanism. Design/methodology/approach – Single lap shear joints with...
Purpose – Power electronics are usually soldered to Al 2 ‐O 3 direct‐bond‐copper (DBC) substrates to increase thermal diffusivity, while at the same time increasing electrical isolation. However, soldering gives rise to inherent residual stresses and out‐of‐plane deformation. The purpose of this...
Purpose – The purpose of this paper is to develop a thermal coupling method of a ball grid array (BGA) assembly during a forced convection reflow soldering process. Design/methodology/approach – The reflow oven was modeled in computational fluid dynamic (CFD) software (FLUENT 6.3.26) while the...
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