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Purpose – The purpose of this paper is to present a novel high speed impact testing method for evaluating the effects of low temperatures on eutectic and lead‐free solder joints. Interfacial cracking failure of Sn‐based and Pb‐free solders at subzero temperatures is of significant concern for...
Purpose – The purpose of this paper is to present a new test method (tape peel method) to evaluate conformal coating adhesion to electronic assemblies. Design/methodology/approach – The key issue for this method is the low cohesive force of conformal coatings, and hence selection of a supporting...
Purpose – The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging. Design/methodology/approach – This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art....
Purpose – The purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. The practical aspect of the obtained results is the main goal of these investigations....
Purpose – The purpose of this paper is to evaluate the application of an acoustic micro‐imaging (AMI) inspection technique in monitoring solder joints through lifetime performance and demonstrate the robustness of the monitoring through analysis of AMI data. Design/methodology/approach –...
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