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Purpose – Accelerated tests are commonly used to evaluate the reliability of electronic components and to detect failures caused by environmental conditions in field use. Many standard accelerated tests are available for evaluating the reliability in a commonly approved way. These tests form a...
Purpose – In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the...
Purpose – The purpose of this paper is to study the reliability of SnAgCu solder interconnections under different thermal shock (TS) loading conditions. Design/methodology/approach – The finite element method was employed to study the thermomechanical responses of solder interconnections in...
Purpose – The purpose of this paper is to investigate tin pest formation in lead‐free alloys. Design/methodology/approach – Samples of Sn99.5Ag3.0Cu0.5, Sn99Cu1 and Sn98Cu2 alloys were prepared in four different forms. The first group was prepared using traditional PCB technology and a hand...
Purpose – The purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal cycling. Design/methodology/approach – QFP devices were selected as the test vehicles and were soldered...
Purpose – The purpose of this paper is to investigate the influence of silver nanoparticle additions on the wetting properties of Sn‐Ag‐Cu (SAC) solder paste. In this investigation, the basic solder paste contained 85 wt.% of commercial Sn 96.5 Ag 3 Cu 0.5 powder (with the particle sizes in...
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