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Purpose – Non‐planarity of assemblies and co‐planarity variation effects on anisotropic conductive adhesive (ACA) assemblies have been a concern for ACA users since the materials are first devised. The primary objective of this paper is to introduce a new experimental method for studying...
Purpose – The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. Design/methodology/approach – This paper presents the impact of six metal organic compounds (Co, Fe, Al; stearate, oxalate, citrate) on the melting and...
Purpose – The purpose of this paper is to visualise the activities of three solders; Sn‐37Pb, Sn‐9Zn and Sn‐3.5Ag on Cu substrates during reflow near their melting points and to relate them with reflow reactions between solder and substrate. Design/methodology/approach – Melting...
Purpose – The purpose of this paper is to investigate the effect of stand‐off height (SOH) on the microstructure and mechanical behaviour of the solder joints in high density interconnection. Design/methodology/approach – Cu/Sn/Cu solder joints with 100, 50, 20 and 10 μ m SOH are prepared...
Purpose – The purpose of this paper is to describe the effects of mechanical testing and thermal treatment prior to storage at either −18 or −40°C, for periods in excess of ten years on the Sn‐37Pb alloy. Design/methodology/approach – For over a decade, The Solder Research Group at The...
Purpose – The purpose of this paper is to develop a novel automatic and accurate measurement technique for the volume of solder which is present in solder paste in pin‐in‐paste (PIP) technology and a calculation algorithm for predicting solder joint quality. Design/methodology/approach –...
Purpose – Personal and portable electronic devices are becoming an important part of the everyday lives. Electronics miniaturization has been and continues to be the most important driver in this development. The current level of miniaturization has made the use of solder joints challenging and...
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