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Purpose – The purpose of this paper is a comparable evaluation of the influence of a particular element (Bi and Sb) added to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface and interfacial tensions, as well as the wetting properties on the Cu substrate expressed by the wetting angle....
Purpose – The paper aims to focus on lowering the soldering temperature of ionic compound free soldering using 9,10‐dihydroanthracene as a hydrocarbon flux. Design/methodology/approach – The ability of 9,10‐dihydroanthracene to reduce cupric oxide in the presence of peroxides including tert...
Purpose – This paper aims to offer a convenient method to develop an oven recipe for a specific soldering profile in a reflow process. The method is devised to quickly achieve proper profile shape and heating factor Q η , a measure of success for high reliability of the solder joints reflowed....
Purpose – This paper aims to describe some of the European Space Agency (ESA) workmanship standards which are based on industrial practices. Coordination with National Aeronautics and Space Administration (NASA) Centres on workmanship issues is also to be described. Design/methodology/approach –...
Purpose – The purpose of this paper is to examine the microstructure and evaluate the intermetallic compounds in the following lead‐free solder alloys: Sn 98.5 Ag 1.0 Cu 0.5 (SAC105) Sn 97.5 Ag 2.0 Cu 0.5 (SAC205) Sn 96.5 Ag 3.0 Cu 0.5 (SAC305) and Sn 95.5 Ag 4.0 Cu 0.5 (SAC405)....
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