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Purpose – This paper aims to investigate the metallurgical reactions between two commercial AgPt thick films used as a solder land on a low temperature co‐fired ceramic (LTCC) module and solder materials (SnAgCu, SnInAgCu, and SnPbAg) in typical reflow conditions and to clarify the effect of...
Purpose – This paper seeks to decrease the soldering temperature of capacitors using Sn‐Bi plated Sn‐3.5 wt%Ag solder. Design/methodology/approach – Sn‐Bi layers were electroplated on Sn‐3.5 wt%Ag solder. As soldering examples, type 1608 capacitors electroplated with Sn, and printed circuit...
Purpose – The objective of this investigation is the derivation of a mathematical model that describes the pressure characteristics of paste during the stencil printing process. This model is intended to generalise a qualitative understanding of these effects using squeegees that can be curved...
Purpose – This paper aims to present an open‐ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the system, enabling design of physical prototypes to be optimized, expediting the development process....
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