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Purpose – This paper aims to establish a method to optimize reflow profiles and achieve high reliability of solder joints on the basis of the heating factor, Q η , a measure of the reflow profile related to reliability of reflow processed products. Design/methodology/approach – The focus of the...
Purpose – To optimize the printed circuit board design and assembly processes to minimize defects in the assembly of 01005 size chip resistors. Design/methodology/approach – A test board was designed with a range of pad sizes, pad shapes, pad spacings and pad orientations. This test board was...
Purpose – To investigate effects of the thermal history on intermetallic thickness and morphology and on the resulting shear strength of the ball attachment for a variety of BGA components. Design/methodology/approach – In this study, a variety of BGA components with balls made of Pb‐free...
Purpose – The ever present need for the miniaturization of electronic assemblies has driven the size of passive components to as small as the 01005 package size. However, the packaging standards for these components are still under development. The purpose of this work is to report results from...
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