1 - 7 of 7 articles
Purpose – To study the interface properties of anisotropic conductive adhesives (ACAs) and improve the electrical properties of ACA joints as a replacement for Sn/Pb solder in the electronics industry. Design/methodology/approach – In this study, different types of self‐assembled monolayer (SAM)...
Purpose – In the flip‐chip technology (FCT) used in current microelectronic packages, a Ni‐based under‐bump metallurgy (UBM) is widely used due to its slow reaction rate with Sn. In this study, solders joints of eutectic Pb‐Sn with a Ni UBM were employed to investigate the intermetallic compound...
Purpose – This paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy‐based binder that are caused by differences in the curing conditions. Design/methodology/approach – In‐situ monitoring of the various processes that were...
Purpose – To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn‐Pb solder which has previously been used in the electronics...
Purpose – This paper discusses the use of modelling techniques to predict the reliability of an anisotropic conductive film (ACF) flip chip in a humid environment. The purpose of this modelling work is to understand the role that moisture plays in the failure of ACF flip chips....
Purpose – To provide an approach to fleXBGA design and reliability analysis. Design/methodology/approach – A two‐dimensional (2D) plane strain finite element analysis model is established to simulate the thermo‐mechanical behaviour of fleXBGAs which are subjected to thermo‐cyclic loading under...
Purpose – This paper aims to present a new micro‐impact tester developed for characterizing the impact properties of solder joints and micro‐structures at high‐strain rates, for the microelectronic industry, and the results evaluated for different solder ball materials, pad finishes and thermal...
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