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Purpose – The resistance, capacitance and inductance of anisotropic conductive film (ACF) connections determine their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint contributes to time delays and cross‐talk noise as well as simultaneous...
Purpose – This paper aims to present a viscoplastic constitutive model of Sn‐Pb solder taking into account the evolution of microstructure and damage growth in the material. Design/methodology/approach – The microstructure evolution is represented by a parameter describing the coarsening of the...
Purpose – To understand the roles of service‐related parameters, such as imposed cyclic strain amplitude and cyclic strain rate, on the stress relaxation behaviour of eutectic Sn‐Ag solder joints. Design/methodology/approach – Cyclic shear straining with associated stress relaxation at the shear...
Purpose – To draw attention to the need to consider design and performance, as well as production, in the implementation of lead‐free solders. Design/methodology/approach – The potential failure modes of solder joints and their underlying causes are reviewed. A hypothetical design exercise is...
Purpose – To design a flexible integrated robotic assembly and rework (remanufacturing) cell for assembly, selective assembly and rework of advanced surface mount components (SMCs) using the generic methodology developed in this paper. Design/methodology/approach – Manual rework procedures are...
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