1 - 6 of 6 articles
Purpose – Sn‐Zn based lead free solders with a melting temperature around 199°C are an attractive alternative to the conventional Sn‐Pb solder and the addition of bismuth improves its wetability. Whilst lead‐free soldering with Sn‐8Zn‐3Bi has already been used in the electronics assembly...
Purpose – To investigate how jamming of particles in a solder paste varies as a function of the gap through which the particles flow, and to correlate this with skipping defects during the printing process. Design/methodology/approach – Solder pastes with particle sizes of types 2, 3, 4 and 5...
Purpose – Provide information on the effects of flux residues from surface mount assembly on radio frequency (RF) performance. Design/methodology/approach – A series of test vehicles designed to evaluate the RF performance on various test patterns and some simple circuits. Empirical testing is...
Purpose – To provide further knowledge of the effect of solder composition and PCB surface finish on the creep properties of lead‐free SnAgCu solder joints. Design/methodology/approach – Single‐overlap shear specimens were prepared for the creep testing. The test matrix included three different...
Purpose – To investigate the degradation of lead free solder heat‐sink attachment by thermal shock. Samples with high voiding percentages were selected for the investigation in order to get information on the significance of voids on the reliability of Sn‐Ag‐Cu heat‐sink attachment....
Purpose – To study the effects of design and assembly process conditions on lead‐free solder joints for an area array component. Design/methodology/approach – Experiments using SnAgCu solder for assembling plastic ball grid array components on printed circuit boards (PCBs) were carried out to...
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