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Purpose – Historically, tin‐lead solder has been a commonly used joining material in electronics manufacturing. Environmental and health concerns, due to the leaching of lead from landfills into ground water, have necessitated legislation that restricts the use of lead in electronics. The...
Purpose – The goal of this work is to evaluate the feasibility of soldering tin‐silver‐copper balled BGAs using tin‐lead‐based solder and to investigate the influence of different production parameters on the microstructure of the solder joint. Design/methodology/approach – The soldering of the...
Purpose – To investigate fluxless plasma ball bumping and effect of under bump metallization (UBM) thickness on joint properties using lead‐free solders. Design/methodology/approach – A fluxless soldering process was investigated in this study using Ar‐10 percent H 2 plasma reflow. Balls made...
Purpose – The purpose of this work is to undertake a comparison of accelerated test regimes for assessing the reliability of solder joints, in particular those made using lead‐free solders. Design/methodology/approach – Identical samples of 1206, 0805 and 0603 resistors were subjected to six...
Purpose – Anisotropic conductive film (ACF) is now an attractive technology for direct mounting of chips onto the substrate as an alternative to lead‐free solders. However, despite its various advantages over other technologies, it also has many unresolved reliability issues. For instance, the...
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