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This paper will describe tests of the interconnect reliability of BGA components with tin‐lead bumps soldered with lead‐free solder paste during temperature cycling. Tin‐lead BGA components soldered with tin‐lead solder paste and lead‐free BGA components soldered with lead‐free solder paste were...
The wetting performance and intermetallic formation of a Sn/Ag/Cu alloy on printed circuit board (PCB) surfaces and on component terminations were studied in this work. Two different PCB surface finishes, immersion gold over electroless nickel (Ni/Au) and an organic solderability preservative...
The influence of the thermal reflow profile on the formation and resultant morphology of the intermetallic layer that developed at the Ni particle reinforcements within an eutectic Sn‐Ag composite solder matrix was investigated. The composite solder was fabricated by mechanically dispersing 15...
A methodology was developed to establish baseline metrics for assessing the isothermal aging of 63Sn‐37Pb (or 60Sn‐40Pb) solder joints in circuit board assemblies. Those metrics were the intermetallic compound layer thickness at the Sn‐Pb solder/Cu interface and the Pb‐rich phase particle size...
Plastic ball grid array packages were aged for up to 2000 hours. Various solder ball pad metallurgies were studied and solder ball shear tests were conducted at a range of ageing times. The solder ball shear strength was found to decrease after an initial hardening stage. The deterioration of...
This paper presents a reliability assessment of adhesive joints using chip‐on‐glass (COG) technology which was conducted by testing samples at various aging temperatures and at high humidity.The range of aging temperatures took into account the glass transition temperature (Tg) of the adhesive...
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