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The paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on the printing performance. As the current product miniaturisation trend continues, area array type package solutions are now...
An exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts show the...
Eutectic Sn‐Ag solder is being considered as a potential replacement for Sn‐Pb solders. A potential drawback to using the eutectic Sn‐Ag solder is its higher melting point, 221°C, compared with the eutectic Pb‐Sn solder. Owing to its higher melting temperature, the eutectic Sn‐Ag solder is also...
Flip chips were assembled on to ceramic boards using eutectic tin‐lead solder with underfill and with/without encapsulation for temperature cycling and high‐temperature‐high‐humidity tests. After 1.5 years of testing, the reliability performance of the flip chip on board (FCOB) assemblies was...
The stud bump bonding (SBB) process was evaluated for a flip chip in package application. An SBB packaging process, having a reduced number of process steps compared with the typical SBB process, was proposed. The two separate steps of curing of conductive adhesive and underfill epoxy, which for...
With the established surface mount infrastructure and the temperature constraints of components and printed circuit boards, the melting temperatures of lead‐free solder alloys need to be designed as close to 63Sn/37Pb as practical, and not to exceed 215°C. However, metallurgically, the Sn‐based...
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