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As the demand for flip‐chip products increases, the need for low cost high volume manufacturing processes also increases. Currently solder paste printing is the wafer bumping method of choice for device pitches down to 150‐200ॖm. However, limitations in print quality and stencil manufacture mean...
Impressions gained from two visits to Japan, discussing with representatives of industry and academe the current status regarding the implementation of lead‐free technology, are presented. Driven by the commercial rewards of lead‐free goods, Japan appears to have more clearly articulated targets...
A new concept of 3D‐electronic packaging is presented: Si‐on‐Si multi‐chip module flip‐chip technology with arrays of fine etched and filled vertical electrical interconnections (vias). Arrays of vias with a high number of interconnections, and not only peripheral interconnections are used. A 3D...
Au/In isothermal solidification technique was evaluated as an alternative method for high performance die attachment. Bonding could be achieved at temperatures between 250°C ‐ 3008C for about five to ten seconds. The microstructures of the bonds were studied and their effects on the reliability...
Small and low cost unencapsulated SMD plastic film capacitors were manufactured with different terminal metal compositions and dielectric materials. Capacitors made with a polyethylene naphthalate film dielectric were produced using a winding method. The terminals were metallized using the flame...
In a properly wetted joining system, with tin/lead solder as the filler and copper as the base metals, a layer of intermetallic compounds is usually found at the interface of these two metals. This layer, mainly copper and tin, has profound effects on the joint’s properties and reliability....
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