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We report the design, fabrication, and measurements of a dual-reflective, single-crystal silicon-based micromirror that can perform circumferential scanning for endoscopic optical coherence tomography (EOCT). Full 360- deg optical scan angle (OSA) can be achieved by using a dual-reflective mirror...
Fabrication process of through-Si-via (TSV) interconnects and their electrical characterization method were investigated for 3-D stacked packaging. A prototype, three-layer module with a flip-chip bonding process with anisotropic conductive film (ACF) was fabricated with the process. To measure a...