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A materials science based damage metric is presented for solders in electronic packaging. The damage metric characterizes the damage state when solders are subjected to cyclic thermal strain due to mismatch of the coefficient of thermal expansion (CTE). The damage metric is derived through a...
An investigation was conducted of failure modes and criteria for their occurrence in composite sandwich beams. The initiation of the various failure modes depends on the material properties of the constituents (facings and core), geometric dimensions and type of loading. The beams were made of...
An experimental study has been performed to investigate the shear damage mechanism of aluminium alloy 2024T3 by an in-situ single shear test using scanning electron microscope (SEM). The observation of microstructural change and measurement of shear strain in mesoscale have been undertaken...
In this paper, well-known differential elasto-viscoplastic constitutive equations, accounting for hardening and damage, are reformulated into integral form in order to propose an efficient implicit integration scheme. By working out some examples, it will be shown that the proposed formulation...
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