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Purpose – The purpose of this paper is to present new developments in electrolytic tin plating designed to eliminate the formation of whiskers over time, when tin is plated on copper. Design/methodology/approach – Two main approaches were undertaken to achieve the desired results. The first...
Purpose – Boric acid has been used for many years as a catalyst inhibitor and crosslinking agent to increase the glass transition temperature of epoxy resins for printed circuit boards (PCB), as well as in the glass fibre reinforcement. Recent regulation related to boric acid and its salts by...
Purpose – The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating. Design/methodology/approach – Temperature rise measurements...
Purpose – The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent in the construction of...
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