Select All | Select None
You can now keep track of new articles from Circuit World on your personalized homepage!
Purpose – The purpose of this paper is to present new developments in electrolytic tin plating designed to eliminate the formation of whiskers over time, when tin is plated on copper. Design/methodology/approach – Two main approaches were undertaken to achieve the desired results. The first...
Purpose – Boric acid has been used for many years as a catalyst inhibitor and crosslinking agent to increase the glass transition temperature of epoxy resins for printed circuit boards (PCB), as well as in the glass fibre reinforcement. Recent regulation related to boric acid and its salts by...
Purpose – The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating. Design/methodology/approach – Temperature rise measurements...
Purpose – The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent in the construction of...
results per page
Save this article to read later. You can see your Read Later on your DeepDyve homepage.
To save an article, log in first, or sign up for a DeepDyve account if you don't already have one.
Sign Up Log In
To subscribe to email alerts, please log in first, or sign up for a DeepDyve account if you don't already have one.
Read and print from thousands of top scholarly journals.
Sign up with Facebook
Sign up with Google
Already have an account? Log in
To get new article updates from a journal on your personalized homepage, please log in first, or sign up for a DeepDyve account if you don't already have one.