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Purpose – The purpose of this paper is to present the details of key best practices that can help printed circuit board (PCB) manufacturing companies to optimize energy consumption, conserve materials, and reduce waste and costs. Design/methodology/approach – Various individual opportunities...
Purpose – The purpose of this paper is to present an overview of the alternative testing approaches that may be used to assess interconnect quality and their application to laminate material and plated‐through‐hole (PTH) process control. Design/methodology/approach – The paper introduces...
Purpose – The purpose of this paper is to present an analytical approach to find the reduction in the required number of surface mount capacitors by the use of embedded capacitors in decoupling applications. Design/methodology/approach – The analytical model used to perform decoupling is...
Purpose – The purpose of this paper is to present the optimisation of protocols for the immersion coating of silver onto copper‐track printed circuit board (PCB) assemblies, using a novel class of ionic liquid and to show the implementation of the scale up process. Design/methodology/approach...
Purpose – The purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes. Design/methodology/approach – This new finish utilises nanotechnology and is based on a new formulation of the “organic metal” (OM). Findings – The...
Purpose – The purpose of this paper is to present a better understanding of nickel corrosion, also known as “black pad” during gold deposition of EN1G. Design/methodology/approach – This paper presents an accumulation of personal experience and observations of the problem over a period of...
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