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Purpose – The purpose of this paper is to develop simulation models for flexible‐printed circuit boards' flex‐rigid interfaces and to perform experimental tests in the laboratory in order to evaluate the cracking phenomena when these devices are submitted to thermal cycling....
Purpose – The purpose of this paper is to present the power noise characteristics of a multilayer printed circuit board (PCB) in which discrete capacitors have been embedded. Design/methodology/approach – Embedded technology has been implemented on a multilayer PCB to enhance the performance...
Purpose – The purpose of this paper is to present a new multilayer process for three‐dimensional molded interconnect devices (3D‐MIDs) that allows the assembly of modern area array packaged semiconductors. Design/methodology/approach – A new 3D‐MID multilayer process based on local...
Purpose – The purpose of this paper is to investigate the oxidation behaviour of an immersion tin final finish after multiple reflow ageing under air and nitrogen atmospheres and to study their influence on the wetting behaviour with lead‐free solder. To design a model that describes the...
Purpose – The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications. Design/methodology/approach – From a thorough literature...
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