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Purpose – To present a method to model woven fibre reinforced metal matrix composite for multilayer circuit boards. Design/methodology/approach – This paper presents a hybrid modelling method to model multilayer multimaterial composites with the combination of metallic and woven composite...
Purpose – To demonstrate a method of selecting base materials for lead‐free processing based on the kinetics of decomposition. Design/methodology/approach – The paper describes the calculation of Arrhenius kinetic parameters from common “time to delamination” data ( T 260 )....
Purpose – To provide a solution for PCB drilling with strict requirements on hole wall quality. Design/methodology/approach – The influential mechanism of key micro drill bit parameters on hole wall roughness is analyzed. A new type of micro drill bit is developed on the basis of theoretical...
Purpose – Tin‐lead solder has been the primary method for connecting electronic components to printed circuit boards since near the time of its inception. Over the last 60 years, solder has proven a viable assembly method over that time and there is a deep understanding of the technology won...
Purpose – To present a simple way of assessing blind vias, making failure analysis easier to perform and generating less controversy. Design/methodology/approach – The paper describes a procedure that may be used to examine blind via hole interconnections for routine testing or during failure...
Purpose – To introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its consortium of three universities and ten companies and to describe the university research being carried out....
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